Main Raw Material
Silicone
Usage
for Sealing and Bonding in Electronics
Other Names
Modified silicone sealant
Classification
Volatile Solvent Adhesives
Appearance (room temperature)
Black, white, clear
Density (g/cm3, @25°C)
1.2±0.1
Mode of curing
Wet gas curing
Viscosity (mPa.s)
70000-100000
Crusting time (min, @23°C)
10-12
Operating temperature
5 ~ 40 ℃
Elongation at break after curing
>150
Temperature range after curing
-40~120℃